Delta’s next-generation AI Modular Data Center integrates 800VDC high-voltage DC power architecture with advanced liquid cooling technologies, purpose-built for high-density AI and GPU computing environments.
Supports deployment of liquid-cooled AI servers and delivers up to 60kW of IT load per rack, enabling high-density computing. Built on a standard ISO container, the compact system requires only a single parking-space footprint, making it well suited for space-constrained sites.
By integrating multiple power sources—such as renewables, batteries, gensets, SOFCs, and SMRs—the system ensures stable power delivery. In off-grid mode, a resilient multi-bay architecture supports load sharing and fault tolerance.
Delivering 60% efficiency and stable 24-hour power supply, it features a modular design enabling rapid expansion, making it the optimal primary power solution for microgrids.
Directly converts medium-voltage AC to low-voltage DC (800 VDC). With high power density and a modular design, it can reduce footprint and lower power losses.
Designed for AI and hyperscale data center environments, this solution simplifies the power conversion architecture and achieves over 98% system efficiency. Equipped with a total BBU backup capacity of 480 kW, providing short-duration power support for critical loads to enhance power stability and system resilience.
1250kW power in just 1m²! DPH Gen3 smashes power density benchmarks, protecting critical loads with zero interruption and absolute stability.
Can convert 800 VDC to 54 VDC with 98% power conversion efficiency.
Supports three-phase 380–480 VAC input with efficiency exceeding 97%. Provides hot-swap support and PMBus programmability and monitoring.
Delivers high-density liquid cooling, enabling facility and secondary loop separation with precise fluid control. It supports megawatt-scale AI workloads while ensuring high reliability and low PUE performance.
Engineered for high-density AI applications, delivering efficient thermal performance while ensuring stable system operation.
Next-generation 800VDC liquid-to-liquid in-row CDU features N+1 redundant pumps and an optimized flow path, delivering up to 2.4MW cooling capacity in a compact footprint—engineered as a reliable liquid cooling core for high-density AI data centers.
Multiple In-Rack CDU modules are stacked and integrated into an In-Row architecture, enabling scalable cooling performance and centralized management—delivering efficient and stable liquid cooling for high-density computing environments.
Designed for 800VDC AI data centers, it delivers up to 1440LPM and pressure up to 650 kPa (operation point). Its compact and lightweight design ensures efficient and stable cooling for high-density computing environments.
Featuring microchannel and multi-impinging flow design, it enhances heat transfer and reduces flow resistance. With passive flow control and advanced metal bonding processes, it delivers high-efficiency cooling capacity with robust reliability.
Designed for AI-powered smartphones, it features ultra-quiet and low-power operation. Its slim form delivers efficient active cooling to manage high thermal loads, enhancing performance stability and user experience.
Supports 800 VDC architecture for 50 V/12 VDC conversion. It achieves 98% peak efficiency at 1,000W/in³ power density, while its built-in hot-swap capability ensures high reliability for AI data centers.
Offers up to 98.5% efficiency and an ultra-high power density of 8000W/inch³, it features 1.5-2x TDP peak power capability and parallel operation, providing robust power solutions for high-voltage systems and AI chips.
To enhance reliability for HVDC systems, a PWM-based eFuse module features superior current sharing, scalability, and re-rush current control.
Designed for equipment development, DIATwin integrates high-fidelity motion models and physics engines to validate recipes and machine logic prior to production, significantly accelerating R&D while eliminating risks.
Designed for rapid deployment and dynamic production, this flexible modular design enables line changeovers. It perfectly meets small-batch, diverse manufacturing needs, significantly boosting equipment utilization and operational efficiency.